Masaki Hashizume, Ikuro MoritaandHiroshi Okitsu : Estimating the Level of Anesthesia by EEG Analysis, Systems and Computers in Japan, Vol.16, No.1, 42-52, 1985.
Masaki Hashizume, Tasaka Eiji, Takeomi Tamesada, Kayahara ToshihiroandYamazoe Tomohisa : A Practical Functional Test Using Flowchart for Production Testing of Microprocessor Based Sequence Controllers, Transactions of the IEICE of Japan, Vol.E76-D, No.7, 837-841, 1993.
Masaki Hashizume, Y. IwataandTakeomi Tamesada : Performance Evaluation for Fault Detection of Analog Electronic Circuits, Fuzzy Logic and Its Applications to Engineering, (巻), (号), 255-264, 1995.
Toshihiro Sezaki, Masaki Hashizume, Takeomi TamesadaandIkuro Morita : Supply Current Measurement Circuit for Bridging Fault Detection in Microprocessor Based Circuit, Proceedings of ITC-CSCC'97 International Technical Conference on Circuits Systems, Computers and Comunications, 935-938, Okinawa, July 1997.
Masaki Hashizume, Takeomi Tamesada, Takeshi KoyamaandGoor de A.J.van : CMOS SRAM Functional Test with Quiescent Write Supply Current, Proc. of the IEEE International Workshop on IDDQ Testing, (巻), (号), 4-8, San Jose, Nov. 1998.
Toshimasa Kuchii, Masaki HashizumeandTakeomi Tamesada : Test Input Generation for Supply Current Testing of Bridging Faults in Bipolar Combinational Logic Circuits, Proc. of the IEEE International Workshop on IDDQ Testing, (巻), (号), 14-18, San Jose, Nov. 1998.
Masaki Hashizume, Yukiya Miura, Masahiro Ichimiya, Takeomi TamesadaandKozo Kinoshita : A High Speed IDDQ Sensor for Low Voltage ICs, IEEE Seventh Asian Test Symposium, (巻), (号), 327-331, Singapore, Dec. 1998.
Masaki Hashizume, Hiroyuki Yotsuyanagi, Takeomi Tamesada, Eiji TasakaandToshihiro Kayahara : Supply Current testing for Bridging Faults in Microprocessor Based Sequence Control Circuits, Proc. of Electronic Circuits World Convention 8, (巻), (号), 31-37, Tokyo, Sep. 1999.
Masaki Hashizume, Hiroyuki Yotsuyanagi, Takeomi TamesadaandMasashi Takeda : Testability Analysis of IDDQ Testing with Large Threshold Value, IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, (巻), (号), 367-375, Yamanashi Japan, Oct. 2000.
Masaki Hashizume, Hiroyuki Yotsuyanagi, Masahiro Ichimiya, Takeomi TamesadaandMasashi Takeda : High Speed IDDQ Test and Its Testability for Process Variation, IEEE Asian Test Symposium, (巻), (号), 344-349, TAIPEI TAIWAN, Dec. 2000.
Masaki Hashizume, Masahiro Ichimiya, Hiroshi Hoshika, Hiroyuki YotsuyanagiandTakeomi Tamesada : CMOS Open Defect Detection by Supply Current Test, Proc. of Design, Automation and Test in Europe Conference 2001, (巻), (号), 509-513, Munich, March 2001.
Masaki Hashizume, Nobuyuki Inou, Hiroyuki YotsuyanagiandTakeomi Tamesada : Oscillation Frequency Estimation for Detecting Feedback Bridging Faults, Proc. of 2002International Technical Conference on Circuits/Systems, Computers and Communications, Vol.1, (号), 1980-1983, Phuket, Thailand, July 2002.
Takagi Masao, Masaki Hashizume, Masahiro Ichimiya, Hiroyuki YotsuyanagiandTakeomi Tamesada : Testability of Pin Open in Small Outline Package ICs by Supply Current Test, Proc. of the 2003 International Technical Conference on Circuits/Systems, Computers and Communications, (巻), (号), 832-835, Kang-Won Do, Korea, July 2003.
Takagi Masao, Masaki Hashizume, Masahiro Ichimiya, Hiroyuki Yotsuyanagi, Tsukimoto IsaoandTakeomi Tamesada : AC Electric Field for Detecting Pin Opens by Supply Current of CMOS ICs, Proc. of International Conference on Electronics Packaging, (巻), (号), 217-222, Tokyo, April 2004.
Masaki Hashizume, Masahiro Ichimiya, Hiroyuki YotsuyanagiandTakeomi Tamesada : Test Circuit for CMOS Lead Open Detection by Supply Current Testing under AC Electric Field Application, Proc. of the 2004 47-th Midwest Symposium on Circuits and Systems, (巻), (号), I-557-I-560, Hiroshima, July 2004.
Masaki Hashizume, Masahiro Ichimiya, Hiroyuki YotsuyanagiandTakeomi Tamesada : Vectorless Open Pin Detection Method for CMOS Logic Circuits, Proc. of International Conference on Electronics Packaging, (巻), (号), 391-396, Tokyo, April 2005.
Masaki Hashizume, Masahiro Ichimiya, Hiroyuki YotsuyanagiandTakeomi Tamesada : Electric Field for Detecting Open Leads in CMOS Logic Circuits by Supply Current Testing, Proc. of IEEE International Symposium on Circuits and Systems, (巻), (号), 2995-2998, Kobe, May 2005.
Masaki Hashizume, Masahiro Ichimiya, Hiroyuki YotsuyanagiandTakeomi Tamesada : Open Lead Detection Based on Supply Current of CMOS Logic Circuits by AC Voltage Signal Application, Proceedings of ICEP2006, (巻), (号), 147-152, Tokyo, April 2006.
Ono Akira, Masaki Hashizume, Masahiro IchimiyaandHiroyuki Yotsuyanagi : Open Lead Detection of CMOS Logic Circuits by Low Pressure Probing, Proceedings of ICEP2007, 359-364, Tokyo, April 2007.
Masaki Hashizume, Masahiro Ichimiya, Akira OnoandHiroyuki Yotsuyanagi : Test Circuit for Vectorless Open Lead Detection of CMOS ICs, IEEE 6-th International Board Test Workshop, Fort Collins, Oct. 2007.
Akira Ono, Masahiro Ichimiya, Hiroyuki Yotsuyanagi, Masao TakagiandMasaki Hashizume : Test Method for DetectingOpen Leads of Low Voltage LSIs, Proceedings of ICEP2008, 457-462, Tokyo, June 2008.
Masaki Hashizume, Yuichi Yamada, Hiroyuki Yotsuyanagi, Toshiyuki Tsutsumi, Koji Yamazaki, Yoshinobu Higami, Hiroshi TakahashiandYuzo Takamatsu : Fault Analysis of Interconnect Opens in 90nm ICs with Device Simulator, Proc. of 2008 International Technical Conference on Circuits/Systems, Computers and Communications, 249-252, Shimonoseki, Japan, July 2008.
Akira Ono, Masahiro Ichimiya, Hiroyuki Yotsuyanagi, Masao TakagiandMasaki Hashizume : Open Lead Detection Based on Logical Change Caused by AC Voltage Signal Stimulus, Proc. of 2008 International Technical Conference on Circuits/Systems, Computers and Communications, 241-244, Shimonoseki,Japan, July 2008.
Yutaka Hata, Masaki Hashizume, Hiroyuki YotsuyanagiandYukiya Miura : Current Testble Design of Resistor String DACs for Open Defects, Proc. of 2008 International Technical Conference on Circuits/Systems, Computers and Communications, 1533-1536, Shimonoseki, Japan, July 2008.
Masaki Hashizume, Akihito Shimoura, Masahiro IchimiyaandHiroyuki Yotsuyanagi : Test Circuit for Locating Open Leads of QFP ICs, IEEE 7-th International Board Test Workshop, Fort Collins, USA, Sep. 2008.
Koji Yamazaki, Toshiyuki Tsutsumi, Hiroshi Takahashi, Yoshinobu Higami, Takashi Aikyo, Yuzo Takamatsu, Hiroyuki YotsuyanagiandMasaki Hashizume : A Novel Approach for Improving the Quality of Open Fault Diagnosis, Proc. of 22nd International Conference on VLSI Design, 85-90, New Delhi, India, Jan. 2009.
Hiroyuki Yotsuyanagi, Masaki Hashizume, Toshiyuki Tsutsumi, Koji Yamazaki, Takashi Aikyo, Yoshinobu Higami, Hiroshi TakahashiandYuzo Takamatsu : Fault Effect of Open Faults Considering Adjacent Signal Lines in a 90 nm IC, Proc. of 22nd International Conference on VLSI Design, 91-96, New Delhi, India, Jan. 2009.
Akira Ono, Hiroyuki Yotsuyanagi, Masao TakagiandMasaki Hashizume : Open Lead Detection of QFP ICs Using Logic Gates as Open Sensors, Proc. of 2009 International Conference on Electronics Packaging, 434-439, Kyoto,Japan, April 2009.
Masaki Hashizume, Yutaka Hata, Hiroyuki YotsuyanagiandYukiya Miura : Current Testable Design of Resistor String DACs for Short Defects, Proc. of 2009 International Technical Conference on Circuits/Systems, Computers and Communications, 428-431, Jeju,Korea, July 2009.
Toshiyuki Tsutsumi, Yasuyuki Kariya, Masaki Hashizume, Hiroyuki Yotsuyanagi, Koji Yamazaki, Yoshinobu Higami, Hiroshi TakahashiandYuzo Takamatsu : Preliminary Analysis of Interconnect Full Open Faults using TEG chips, Proc. of 2009 International Technical Conference on Circuits/Systems, Computers and Communications, 679-682, Jeju, Korea, July 2009.
Isao Tsukimoto, Hiroyuki YotsuyanagiandMasaki Hashizume : Feasibility of IDDQ Tests for Shorts in Deep Submicron ICs, Proc. of 2009 International Technical Conference on Circuits/Systems, Computers and Communications, 794-796, Jeju,Korea, July 2009.
Shohei Kondo, Katsuya Manabe, Masao Takagi, Hiroyuki YotsuyanagiandMasaki Hashizume : Faulty Effects on Logic Signal of a Hard Open Via from Adjacent Ones, Proceedings of ICEP2010, 711-715, Sapporo, Japan, April 2010.
Masaki Hashizume, Kenichi Uchikura, Akira Ono, Hiroyuki YotsuyanagiandMasao Takagi : Built-in Test Circuit for Opens at Interconnects between Dies inside SiPs, Proceedings of ICEP2010, 705-710, Sapporo, Japan, April 2010.
Masaki Hashizume, Kazuya Nakaminami, Hiroyuki Yotsuyanagi, Yukunori NakajimaandKozo Kinoshita : Current-Based Testable Design of Level Shifters in Liquid Crystal Display Drivers, Proc. of 2010 15th European Test Symposium, 262, Prague, May 2010.
Masaki Hashizume, Shohei KondoandHiroyuki Yotsuyanagi : Possibility of Logical Error Caused by Open Defects in TSVs, Proc. of 2010 International Technical Conference on Circuits/Systems, Computers and Communications, 907-910, Pattaya,Thailand, July 2010.
Lee Heejin, Hiroyuki YotsuyanagiandMasaki Hashizume : Lighting Circuit Analysis Method with Measured I-V Characteristics of LEDs, Proc. of 2010 International Technical Conference on Circuits/Systems, Computers and Communications, 1262-1265, Pattaya,Thailand, July 2010.
Masaki Hashizume, Yutaka Hata, Hiroyuki YotsuyanagiandYukiya Miura : A Supply Current Testable DAC of Resistor String Type, Proc. RISP International Workshop on Nonlinear Circuit and Signal Processing, 13-16, TianJin,China, March 2011.
Shohei Kondo, Hiroyuki YotsuyanagiandMasaki Hashizume : Fault Analysis of Soft Open Defects in TSVs with Electromagnetic Simulator, Proceedings of ICEP2011, 727-731, Nara, Japan, April 2011.
Katsuya Manabe, Hiroyuki Yotsuyanagi, Toshiyuki Tsutsumi, Koji Yamazaki, Yoshinobu Higami, Hiroshi Takahashi, Yuzo TakamatsuandMasaki Hashizume : Estimation of Faulty Effects Caused by a Clack at an Interconnect Line in 90nm ICs, Proceedings of ICEP2011, 737-742, Nara, Japan, April 2011.
Shohei Kondo, Hiroyuki YotsuyanagiandMasaki Hashizume : Faulty Effect of Soft Open Defect in TSV Caused by Logic Values of Neighboring TSVs, Proc. of 2011 International Technical Conference on Circuits/Systems, Computers and Communications, 692-695, Gyeongju, Korea, June 2011.
Tomoaki Konishi, Hiroyuki YotsuyanagiandMasaki Hashizume : Feasibility of Electrical Testing for Lead Opens of QFP ICs, Proc. of 2011 International Technical Conference on Circuits/Systems, Computers and Communications, 688-691, Gyeongju, Korea, June 2011.
Yoshihiko Miyamori, Hiroyuki YotsuyanagiandMasaki Hashizume : Practical Testability of Supply Current Testable DACs of Resistor Type, Proc. of 2011 International Technical Conference on Circuits/Systems, Computers and Communications, 1015-1018, Gyeongju, Korea, June 2011.
Lee Heejin, Hiroyuki Yotsuyanagi, Sohn KyungrakandMasaki Hashizume : Feasibility of Operating Point Estimation in Lighting Circuit with Measured I-V Characteristics of LEDs, Proc. of 2011 International Technical Conference on Circuits/Systems, Computers and Communications, 1026-1029, Gyeongju, Korea, June 2011.
(名) Widianto, Akira Ono, Hiroyuki Yotsuyanagi, Masao TakagiandMasaki Hashizume : Feasibility of Open Lead Detection with Built-in Current Sensor, Journal of Shikoku-Section Joint Convention of the Institutes of Electrical and Related Engineers, 119, Sep. 2011.
Masaki Hashizume, Yutaka Hata, Hiroyuki YotsuyanagiandYukiya Miura : A Supply Current Testable Register String DAC of Decoder Type, Proc. of 11th International Symposium on Communications and Information Technologies, 58-63, China, Hangzhou, Oct. 2011.
Shohei Kondo, Hiroyuki YotsuyanagiandMasaki Hashizume : Propagation Delay Analysis of a Soft Open Defect inside a TSV, Transactions of The Japan Institute of Electronics Packaging, Vol.4, No.1, 119-126, 2011.
(名) Widianto, Hiroyuki Yotsuyanagi, Akira Ono, Masao TakagiandMasaki Hashizume : A Built-in Test Circuit for Open Defects at Interconnects between Dies in 3D ICs, International 3D System Integration Conference, P-2-31-1-P-2-31-5, Osaka, Feb. 2012.
Tomoaki Konishi, Hiroyuki YotsuyanagiandMasaki Hashizume : Supply Current Testing of Open Defects at Interconnects in 3D ICs with IEEE 1149.1 Architecture, International 3D System Integration Conference, 8-2-1-8-2-6, Osaka, Feb. 2012.
Tomoaki Konishi, Hiroyuki YotsuyanagiandMasaki Hashizume : An Electrical Test Circuit for Detecting Interconnect Open Defects in 3D ICs, Proceedings of ICEP2012, 88-93, Tokyo, Japan, April 2012.
Shingo Saijo, Hiroyuki Yotsuyanagi, Masaki HashizumeandKozo Kinoshita : Testable Design of CMOS Image Pixel Circuits for Electrical Testing, Proc. of 2012 International Technical Conference on Circuits/Systems, Computers and Communications, D-W2-04-1-D-W2-04-4, Sapporo, July 2012.
Shohei Suenaga, Hiroyuki YotsuyanagiandMasaki Hashizume : A Built-in Sensor for IDDT Testing of CMOS ICs, Proc. of 2012 International Technical Conference on Circuits/Systems, Computers and Communications, E-M2-05-1-E-M2-05-4, Sapporo, July 2012.
Takahashi Hiroshi, Higami Yoshinobu, Yamazaki Koji, Tsutsumi Toshiyuki, Hiroyuki YotsuyanagiandMasaki Hashizume : Test Generation for Resistive Open Faults with Considering Adjacent Lines, Proc. of 2012 International Technical Conference on Circuits/Systems, Computers and Communications, P-T2-06-1-P-T2-06-4, Sapporo, July 2012.
Tomoaki Konishi, Hiroyuki YotsuyanagiandMasaki Hashizume : A Built-in Test Circuit for Supply Current Testing of Open Defects at Interconnects in 3D ICs, Proc. of 4-th Electronics System Integration Technologies Conference(ESTC 2012), PA21.1_1-PA21.1_6, Amsterdam, Sep. 2012.
Masaki Hashizume, Tomoaki KonishiandHiroyuki Yotsuyanagi : Electrical Interconnect Testing of Open Defects in Assembled PCBs Utilizing IEEE 1149.1 Test Mechanism, International Test Conference 2012, PO1, Anaheim, Nov. 2012.
Masaki Hashizume, Shohei Kondo, Ei Haraguchi, Hiroyuki Yotsuyanagi, Tetsuo TadaandZvi Roth : Output Voltage Estimation Method of Hard Open TSV in 3D ICs, Digest of Papers of the 13-th IEEE Workshop on RTL and High Level Testing, 6.1.1-6.1.5, Niigata, Nov. 2012.
Jun Yamashita, Hiroyuki Yotsuyanagi, Masaki HashizumeandKozo Kinoshita : On Detectability Analysis of Open Faults Using SAT-based Test Pattern Generation Considering Adjacent Lines, Digest of Papers of the 13-th IEEE Workshop on RTL and High Level Testing, 2.1.1-2.1.6, Niigata, Nov. 2012.
Tomoaki Konishi, Hiroyuki YotsuyanagiandMasaki Hashizume : Electrical Test Method for Interconnect Open Defects in 3D ICs, Transactions of The Japan Institute of Electronics Packaging, Vol.5, No.1, 26-33, 2012.
(名) Widianto, Hiroyuki Yotsuyanagi, Akira Ono, Masao Takagi, Zvi RothandMasaki Hashizume : A Built-in Electrical Test Circuit for Interconnect tests in Assembled PCBs, Proc. of IEEE CPMT Symposium Japan 2012, 201-204, Kyoto, Dec. 2012.
(名) Widianto, Hiroyuki YotsuyanagiandMasaki Hashizume : Size Reduction of a Built-in Test Circuit for Locating Open Interconnects in 3D ICs, Proc. of International Conference on Electronics, Information and Communication, 302-303, Bali, Indonesia, Feb. 2013.
Masaki Hashizume, Masatake Akutagawa, Shyue-Kung LuandHiroyuki Yotsuyanagi : Electrical Test Method of Open Defects at Bi-directional Interconnects in 3D ICs, Proceedings of ICEP2013, 13-18, Osaka, Japan, April 2013.
Akira Ono, Hiroyuki Yotsuyanagi, Masao TakagiandMasaki Hashizume : Open Defect Detection in Assembled PCBs by Supply Current Testing with Electrodes Embedded inside ICs, Proceedings of ICEP2013, 451-456, Osaka, Japan, April 2013.
LI Tsu-Lin, Masaki HashizumeandShyue-Kung LU : An Efficient Test and Repair Flow for Yield Enhancement of One-Time-Programming NROM-Based ROMs, IEICE Transactions on Information and Systems, Vol.E96-D, No.9, 2026-2030, 2013.
Shoichi Umezu, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Testability of Open Defects at Interconnections in 3D ICs with a Built-in Test Circuit for Supply Current Testing, International Test Conference 2013, PO29, Anaheim, Sep. 2013.
Hiroki Sakurai, Hiroyuki Yotsuyanagi, Masanori NakamuraandMasaki Hashizume : Time-to-Digital Converter Embedded in Boundary-Scan Circuit and Its Application to 3D iC Testing, International Test Conference 2013, PO30, Anaheim, Sep. 2013.
Shohei Suenaga, Masaki Hashizume, Hiroyuki Yotsuyanagi, Tetsuo TadaandShyue-Kung Lu : Built-in IDDT Appearance Time Sensor for Detecting Open Faults in 3D IC, Proc. of IEEE CPMT Symposium Japan(ICSJ2013), 247-250, Kyoto, Nov. 2013.
Ei Haraguchi, Masaki Hashizume, Katsuya Manabe, Hiroyuki Yotsuyanagi, Tetsuo Tada, Shyue-Kung LuandZvi Roth : Reduction Method of Number of Electromagnetic Simulation Times for Estimating Output Voltage at Hard Open TSV in 3D IC, Proc. of IEEE CPMT Symposium Japan(ICSJ2013), 251-254, Kyoto, Nov. 2013.
Masaki Hashizume, Tomoaki Konishi, Hiroyuki YotsuyanagiandShyue-Kung Lu : Testable Design for Electrical Testing of Open Defects at Interconnects in 3D ICs, Proc.of IEEE 22th Asian Test Symposium, 13-18, Yilan,Taiwan, Nov. 2013.
Shoichi Umezu, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung LuandZvi Roth : Feasibility of Interconnect Tests of Open Defects in a 3D IC with a Built-in Supply Current Test Circuit, Digest of Papers of the 14-th IEEE Workshop on RTL and High Level Testing, I.1.F-1-I.1.F-5, Yilan,Taiwan, Nov. 2013.
Akira Ono, Masao Takagi, Hiroyuki YotsuyanagiandMasaki Hashizume : Supply Current Test Method for Pin Open Defects in Assembled PCB Circuits, Digest of Papers of the 14-th IEEE Workshop on RTL and High Level Testing, I.3.S-1-I.3.S-4, Yilan,Taiwan, Nov. 2013.
Jun Yamashita, Hiroyuki Yotsuyanagi, Masaki Hashizume, Yoshinobu HigamiandHiroshi Takahashi : On SAT-based Test Generation for Observing Delay Variation Caused by a Resistive Open Fault and Its Adjacent Lines, Digest of Papers of the 14-th IEEE Workshop on RTL and High Level Testing, IV.2.F-1-IV.2.F-6, Yilan,Taiwan, Nov. 2013.
Jun Yamashita, Hiroyuki Yotsuyanagi, Masaki HashizumeandKozo Kinoshita : SAT-Based Test Generation for Open Faults Using Fault Excitation Caused by Effect of Adjacent Lines, IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, Vol.E96-A, No.12, 2561-2567, 2013.
Shohei Suenaga, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung LuandZvi Roth : DFT for Supply Current Testing to Detect Open Defects at Interconnects in 3D ICs, Proc. of IEEE Electrical Design of Advanced Packaging & Systems (EDAPS) Symposium, 60-63, Nara, Dec. 2013.
Akira Ono, Hiroyuki YotsuyanagiandMasaki Hashizume : Pin Open Detection of BGA IC by Supply Current Testing, Proceedings of International Conference on Electronics Packaging 2014, 231-234, Toyama, Japan, April 2014.
Shoichi Umezu, Masaki HashizumeandHiroyuki Yotsuyanagi : A Built-in Supply Current Test Circuit for Pin Opens in Assembled PCBs, Proceedings of International Conference on Electronics Packaging 2014, 227-230, Toyama, April 2014.
Yudai Shiraishi, Masaki Hashizume, Hiroyuki Yotsuyanagi, Tetsuo TadaandShyue-Kung Lu : Electrical Test Method of Open Defects at Data Buses in 3D SRAM IC, Proc. of International Conference on Electronics Packaging 2014, 235-238, (都市), April 2014.
Shyue-Kung Lu, Huai-Min Li, Masaki Hashizume, Jin-Hua HongandZheng-Ru Tsai : Efficient Test Length Reduction Techniques for Interposer-based 2.5D ICs, Proc. of 2014 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), 1-4, Hsinchu, Taiwan, April 2014.
Masaki Hashizume, Shohei SuenagaandHiroyuki Yotsuyanagi : A Built-in Test Circuit for Detecting Open Defects by IDDT Appearance Time in CMOS ICs, Proc. of the 3rd International Conference on Design and Concurrent Engineering, (都市), Sep. 2014.
Kousuke Nambara, Shoichi Umezu, Hiroyuki Yotsuyanagi, Masaki HashizumeandShyue-Kung Lu : Threshold Value Estimation of Electrical Interconnect, Proc. of IEEE CPMT Symposium Japan 2014, 158-161, (都市), Nov. 2014.
Masaki Hashizume, Yudai Shiraishi, Hiroyuki Yotsuyanagi, Hiroshi Yokoyama, Tetsuo TadaandShyue-Kung Lu : Threshold Setting of Electrical Test Method for Open Defects at Data Bus in 3D SRAM IC, Proc. of the 15th IEEE Workshop on RTL and High Level Testing, 64-68, (都市), Nov. 2014.
Jun Yamashita, Hiroyuki Yotsuyanagi, Masaki Hashizume, Yoshinobu HigamiandHiroshi Takahashi : On SAT-based Test Generation for Resistive Open Using Delay Variation Caused by Effect of Adjacent Lines, Proc. of the 15th IEEE Workshop on RTL and High Level Testing, 49-53, (都市), Nov. 2014.
Chih-Chan Fang, Hiroyuki YotsuyanagiandMasaki Hashizume : A Test Pattern Matching Method on BAST Architecture for Test Data Reduction by Controlling Scan Shift, Proc. of the 15th IEEE Workshop on RTL and High Level Testing, 130-134, (都市), Nov. 2014.
Masaki Hashizume, Shoichi Umezu, Hiroyuki YotsuyanagiandShyue-Kung Lu : A Built-in Supply Current Test Circuit for Electrical Interconnect Tests of 3D ICs, Proc. of IEEE 3D System Integration Conference 2014, O7-1-O7-6, Kinsdale, Ireland, Dec. 2014.
Masaki Hashizume : Electrical Interconnect Test Method of 3D ICs, 2015 UT and Taiwan Tech Joint Workshop on Advanced VLSI Design Technologies, Taipei, March 2015.
Yuki Ikiri, Masaki Hashizume, Hiroyuki Yotsuyanagi, Hiroshi Yokoyama, Tetsuo TadaandShyue-Kung Lu : Switch Circuit for Repairing Defective TSVs in a 3D Stacked Memory IC, Proc. of International Forum on Advanced Technologies 2015, 160-161, Tokushima, March 2015.
Shyue-Kung Lu, Hao-Cheng Jheng, Hao-Wei LinandMasaki Hashizume : Built-in Scrambling Analysis for Yield Enhancement of Embedded Memories, Proc. of International Forum on Advanced Technologies 2015, 44-45, Tokushima, March 2015.
Shyue-Kung Lu, Cheng-Ju TsaiandMasaki Hashizume : Integration of Hard Repair Techniques with ECC for Enhancing Fabrication Yield and Reliability of Embedded Memories, Proc. of International Forum on Advanced Technologies 2015, 68-69, Tokushima, March 2015.
Akihiro Odoriba, Shoichi Umezu, Masaki Hashizume, Hiroyuki Yotsuyanagi, Ali Ashikin Binti FaraandShyue-Kung Lu : A Testable Design for Electrical Interconnect Tests of 3D ICs, Proceedings of 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference, 718-722, Kyoto, Japan, April 2015.
Shyue-Kung Lu, Shu-Ling Lin, Hao-Wei LinandMasaki Hashizume : Hybrid Scrambling Technique for Increasing the Fabrication Yield of NROM-Based ROMs, Proc. of 2015 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), (巻), (号), 1-4, Hsinchu, Taiwan, April 2015.
Yuki Ikiri, Masaki Hashizume, Hiroyuki Yotsuyanagi, Hiroshi Yokoyama, Tetsuo TadaandShyue-Kung Lu : Repair Circuit of TSVs in a 3D Stacked Memory IC, Proc. of International Technical Conference on Circuits/Systems, Computers and Communications 2015, 431-434, Seoul, June 2015.
Daisuke Suga, Hiroyuki YotsuyanagiandMasaki Hashizume : Electrical Test for Open Defects in CMOS ICs by Injected Charge, Proc. of International Technical Conference on Circuits/Systems, Computers and Communications 2015, 653-656, Seoul, June 2015.
Masaki Hashizume, Singo SaijyoandHiroyuki Yotsuyanagi : Electrically Testable CMOS Image Pixel Circuit, Proc. of IEEE 2015 European Conference on Circuit Theory and Design, 1-4, Trondheim, Aug. 2015.
Kosuke Nanbara, Akihiro Odoriba, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Electrical Interconnect Test of 3D ICs Made of Dies without ESD Protection Circuits with a Built-in Test Circuit, Proc. of IEEE 3D System Integration Conference 2015, TS8.22.1-TS8.22.5, Sendai, Sep. 2015.
Daisuke Suga, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Electrical Interconnect Test Method of 3D ICs by Injected Charge Volume, Proc. of IEEE 3D System Integration Conference 2015, TS8.19.1-TS8.19.5, Sendai, Sep. 2015.
Hiroyuki Yotsuyanagi, Akihiro FujiwaraandMasaki Hashizume : On TSV Array Defect Detection Method Using Two Ring-oscillators Considering Signal Transitions at Adjacent TSVs, Proc. of IEEE 3D System Integration Conference 2015, TS8.24.1-TS8.24.4, (都市), Sep. 2015.
Akihiro Odoriba, Masaki Hashizume, Shoichi UmezuandHiroyuki Yotsuyanagi : A Design for Testability with nMOS Switches to Detect Open pins in Assembled PCBs, Proc. of International Design and Concurrent Engineering Conference 2015, 31-1-31-6, Tokushima, Sep. 2015.
Kosuke Nanbara, Shoichi Umezu, Hiroyuki Yotsuyanagi, Masaki HashizumeandShyue-Kung Lu : Threshold Value Estimation Method for Electrical Interconnect Tests of 3D ICs, IEEE CASS Shikoku and Malaysia Chapters Joint Seminar, Oct. 2015.
Shyue-Kung Lu, Hao-Wei LinandMasaki Hashizume : An Enhanced Built-In Self-Repair Technique For Yield And Reliability Improvement Of Embedded Memories, Proc. of 2015 IEEE 11th International Conference on ASIC (ASICON), 1-4, Chengdu, China, Nov. 2015.
Masaki Hashizume, Shoichi Umezu, Yuki Ikiri, Ali Ashikin Binti Fara, Hiroyuki YotsuyanagiandShyue-Kung Lu : Electrical Interconnect Test Method of 3D ICs without Boundary Scan Flip Flops, Proc. of IEEE CPMT Symposium Japan 2015, 136-139, Kyoto, Nov. 2015.
Masaki Hashizume, Shoichi Umezu, Yuki Ikiri, Hiroyuki YotsuyanagiandShyue-Kung Lu : Test Circuit for Electrical Interconnect Tests of 3D ICs without Boundary Scan Flip Flops, Proc. of the 16th IEEE Workshop on RTL and High Level Testing, 23-28, Mumbai, Nov. 2015.
Shyue-Kung Lu, Tsai Cheng-JuandMasaki Hashizume : Integration of Hard Repair Techniques with ECC for Enhancing Fabrication Yield and Reliability of Embedded Memories, Proc. of 2015 IEEE 24th Asian Test Symposium, 49-54, (都市), Nov. 2015.
Shyue-Kung Lu, Shu-Chi YuandMasaki Hashizume : Synergistic Built-in Self-Repair Techniques for Enhancing Fabrication Yield of Embedded Memories, Proc. of International Forum on Advanced Technologies 2016, 59-61, Tokushima, March 2016.
Masaki Hashizume, Yuki Ikiri, Shoichi Umezu, Ali Ashikin Binti Fara, Hiroyuki YotsuyanagiandShyue-Kung Lu : Feasibility of Electrical Test for Open Defects at Address Bus in 3D Memory IC, Proc. of International Forum on Advanced Technologies 2016, 51-53, Tokushima, March 2016.
Yuki Ikiri, Masaki Hashizume, Hiroyuki Yotsuyanagi, Hiroshi Yokoyama, Tetsuo TadaandShyue-Kung Lu : Die Design for Cost reduction of 3F Stacked Memory ICs, Proc. of International Forum on Advanced Technologies 2016, 79-80, Tokushima, March 2016.
Shyue-Kung Lu, Shu-Chi YuandMasaki Hashizume : Hybrid Scrambling Technique for Increasing the Fabrication Yield of NROM-Based ROMs, Proc. of International Forum on Advanced Technologies 2016, 207-209, Tokushima, March 2016.
Ali Ashikin Binti Fara, Akihiro Odoriba, Masaki Hashizume, Shoichi Umezu, Hiroyuki YotsuyanagiandShyue-Kung Lu : Electrical Tests of Capacitive Open Defects at BGA ICs in Assembled PCB, Proc. of International Forum on Advanced Technologies 2016, 229-231, Tokushima, March 2016.
Takumi Miyabe, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung LuandZvi Roth : A Built-in Electrical Test Circuit for Detecting Open Leads in Assembled PCB Circuits with RC Integrator, Proceedings of International Conference on Electronics Packaging 2016, 451-455, Sapporo, April 2016.
Masashi Okamoto, Akihiro Odoriba, Hiroyuki Yotsuyanagi, Masaki HashizumeandShyue-Kung Lu : A Built-in Test Circuit to Monitor Changing Process of Resistive Open Defects in 3D ICs, Proc. of International Technical Conference on Circuits/Systems, Computers and Communications 2016, 295-298, Okinawa, July 2016.
Kouhei Ohtani, Daisuke Suga, Hiroyuki YotsuyanagiandMasaki Hashizume : A Built-in Test Circuit for Injected Charge Tests of Open Defects in CMOS ICs, Proc. of International Technical Conference on Circuits/Systems, Computers and Communications 2016, 291-294, Okinawa, July 2016.
Masaki Hashizume, Yudai Shiraishi, Hiroyuki Yotsuyanagi, Hiroshi Yokiyama, Tetsuo TadaandShyue-Kung Lu : Electrical Test of Resistive and Capacitive Open Defects at Data Bus in 3D Memory IC, Proc. of International Design and Concurrent Engineering Conference 2016, (巻), (号), Langkawi, Sep. 2016.
Fara Binti Ali Ashikin, Akihiro Odoriba, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Electrical Tests for Capacitive Open Defects in Assembled PCBs, Proc. of International Design and Concurrent Engineering Conference 2016, (巻), (号), (頁), Langkawi, Sep. 2016.
(名) Widiant, Masaki Hashizume, Shohei Suenaga, Hiroyuki Yotsuyanagi, Akira Ono, Shyue-Kung LuandZvi Roth : A Built-in Test Circuit for Electrical Interconnect Testing of Open Defects in Assembled PCBs, IEICE Transactions on Information and Systems, Vol.E99-D, No.11, 2723-2733, 2016.
Masaki Hashizume, Akihiro Odoriba, Hiroyuki YotsuyanagiandShyue-Kung Lu : A Built-in Defective Level Monitor of Resistive Open Defects in 3D ICs with Logic Gates, Proc. of IEEE CPMT Symposium Japan 2016, 99-102, Kyoto, Nov. 2016.
Kouhei Ohtani, Masaki Hashizume, Daisuke Suga, Hiroyuki YotsuyanagiandShyue-Kung Lu : A Power Supply Circuit for Interconnect Tests Based on Injected Charge Volume of 3D IC, Proc. of IEEE CPMT Symposium Japan 2016, 139-140, Kyoto, Nov. 2016.
Ali Ashikin Binti Fara, Masaki Hashizume, Yuki Ikiri, Hiroyuki YotsuyanagiandShyue-Kung Lu : Testability for Resistive Open Defects by Electrical Interconnect Test of 3D ICs without Boundary Scan Flip Flops, Proc. of IEEE CPMT Symposium Japan 2016, 137-138, Kyoto, Nov. 2016.
Shyue-Kung Lu, Shang-Xiu ZhongandMasaki Hashizume : Enhancement of Flash MemoriesAdaptive ECC Techniques for Yield and Reliability, Proc. of 2016 IEEE 25th Asian Test Symposium, 287-292, Hiroshima, Nov. 2016.
Takumi Kawaguchi, Hiroyuki YotsuyanagiandMasaki Hashizume : On Control Circuit and Observation Conditions for Testing Multiple TSVs Using Boundary Scan Circuit with Embedded TDC, Proc. of the 17th IEEE Workshop on RTL and High Level Testing, 1-3-1-1-3-6, Hiroshima, Nov. 2016.
Fara Ashikin Binti Ali, Yuki Ikiri, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Capacitive Open Defect Detection by Electrical Interconnect Test of 3D ICs without Boundary Scan Flip Flops, Proc. of the 17th IEEE Workshop on RTL and High Level Testing, 1-2-1-1-2-6, Hiroshima, Nov. 2016.
Masaki Hashizume, Hiroyuki Yotsuyanagi, Hiroshi Yokoyama, Tetsuo TadaandShyue-Kung Lu : Test Input Vectors for Detecting Stuck-at Faults at Address and Data Buses in 3D Stacked Memory ICs, Proc. of International Forum on Advanced Technologies 2017, 127-129, Hualien, Taiwan, March 2017.
Michiya Kanda, Masaki Hashizume, Akihiro Odoriba, Yohei Kakee, Hiroyuki YotsuyanagiandShyue-Kung Lu : A Built-in Test Circuit Using A Comparator of Offset Cancel Type for Electrical Interconnect Tests of 3D Stacked ICs, Proc. of International Forum on Advanced Technologies 2017, 233-235, Hualien, Taiwan, March 2017.
Michiya Kanda, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Capacitive Open Detection in 3D ICs with A Built-in Comparator of Offset Cancellation Type, IEEE 2017 Taiwan and Japan Conference on Circuits and Systems, Okayama, Aug. 2017.
Kouhei Ohtani, Naho Osato, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : A Defect Level Monitor of Resistive Open Defect at Interconnects in 3D ICs by Injected Charge Volume, Proc. of 17th International Symposium on Communications and Information Technologies, 46-50, Cairns, Sep. 2017.
Yuuya Ohama, Masaki Hashizume, Hiroyuki Yotsuyanagi, Yoshinobu HigamiandHiroshi Takahashi : On Selection of Adjacent Lines in Test Pattern Generation for Delay Faults Considering Crosstalk Effects, Proc. of 17th International Symposium on Communications and Information Technologies, 96-100, Cairns, Sep. 2017.
Masaki Hashizume, Yudai Shiraishi, Hiroyuki Yotsuyanagi, Hiroshi Yokoyama, Tetsuo TadaandShyue-Kung Lu : Electrical Test of Resistive and Capacitive Open Defects at Data Bus in 3D Memory IC, Journal of Telecommunication, Electronic and Computer Engineering, Vol.9, No.3-2, 39-42, 2017.
Fara Alia Ashikin, Akihiro Odoriba, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Electrical Tests for Capacitive Open Defects in Assembled PCBs, Journal of Telecommunication, Electronic and Computer Engineering, Vol.9, No.3-2, 49-52, 2017.
Michiya Kanda, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : A Built-in Current Sensor Made of a Comparator of Offset Cancellation Type for Electrical Interconnect Tests of 3D ICs, Proc. of IEEE CPMT Symposium Japan 2017, 137-138, Kyoto, Nov. 2017.
Kouhei Ohtani, Naho Osato, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Resistive Open Defects Detected by Interconnect Testing Based on Charge Volume Injected to 3D ICs, Proc. of IEEE CPMT Symposium Japan 2017, 231-234, Kyoto, Nov. 2017.
Ayumu Kambara, Hiroyuki Yotsuyanagi, Daichi Miyoshi, Masaki HashizumeandShyue-Kung Lu : Open Defect Detection with a Built-in Test Circuit by IDDT Appearance Time in CMOS ICs, Proc.of IEEE 26th Asian Test Symposium, 237-242, Taipei, Nov. 2017.
Hiroyuki Yotsuyanagi, Kotaro Ise, Masaki Hashizume, Yoshinobu HigamiandHiroshi Takahashi : Discrimination of a Resistive Open Using Anomaly Detection of Delay Variation Induced by Transitions on Adjacent Lines, IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences, Vol.E100-A, No.12, 2842-2850, 2017.
Hanna Soneda, Michiya Kanda, Masaki Hashizume, Hiroyuki YotsuyanagiandKung Shyue LU : Detectable Resistive Open Defects in 3D ICs with Electrical Interconnect Test Circuit Made of Diodes, Proc. of 2018 RISP International Workshop on Nonlinear Circuits, Communications, 655-658, (都市), March 2018.
Miyatake Noriko, Masaki Hashizume, Hiroyuki Yotsuyanagi, Hiroshi YokoyamaandTetsuo Tada : Oscillation Frequency Estimation of Ring Oscillator for Interconnect Tests in 3D Stacked ICs, Proc. of 2018 RISP International Workshop on Nonlinear Circuits, Communications, 659-662, (都市), March 2018.
Michiya Kanda, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Resistive Open Defect Detection in 3D ICs with a Comparator of Offset Cancellation Type under Process Variation, Proc. of International Forum on Advanced Technologies 2018, P1-11-1-P1-11-3, Tokushima, Japan, March 2018.
Alia Ashikin Fara, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Electrical Tests for Capacitive Open Defects in Assembled PCBs, Proc. of International Forum on Advanced Technologies 2018, P1-12-1-P1-12-3, Tokushima, Japan, March 2018.
Jumpei Kawano, Hiroyuki YotsuyanagiandMasaki Hashizume : Effect of Routing in Testing a TSV Array Using Boundary Scan Circuit with Embedded TDC, Proc. of International Forum on Advanced Technologies 2018, P1-13-1-P1-13-3, Tokushima, Japan, March 2018.
Masaki Hashizume : Health Monitoring of Electronic Circuits in IoT Systems, Proc. of International Forum on Advanced Technologies 2019, 29, Taipei, Taiwan, March 2018.
Jumpei Kawano, Hiroyuki YotsuyanagiandMasaki Hashizume : On Design and Evaluation of a TDC Cell Embedded in the Boundary Scan Circuit for Delay Fault Testing of 3D ICs, Proc. of 33rd International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC 2018), 110-113, Bangkok, July 2018.
Ishihara Ken, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Resistive Open Defects in 3D Stacked ICs Detected by Electrical Interconnect Testing with a Charge Injector Made of MOS Capacitors, Proc. of 33rd International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC 2018), 114-117, Bangkok, July 2018.
ASHIKIN Fara, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung LUandZvi ROTH : A Design for Testability of Open Defects at Interconnects in 3D Stacked ICs, IEICE Transactions on Information and Systems, Vol.E101-D, No.8, 2053-2063, 2018.
Satoshi Hirai, Hiroyuki YotsuyanagiandMasaki Hashizume : Test Time Reduction on Testing Delay Faults in 3D ICs Using Boundary Scan Design, Proc.of IEEE 27th Asian Test Symposium, 7-12, Hefei, Oct. 2018.
Yuta Matsumoto, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Resistive Open Defect Detection in SoCs by a Test Method Based on Injected Charge Volume after Test Input Application, Proc. of IEEE CPMT Symposium Japan 2018, 141-142, Kyoto, Nov. 2018.
Michiya Kanda, Daisuke Yabui, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Stand-by Mode Test Method of Interconnects between Dies in 3D ICs with IEEE 1149.1 Test Circuits, Proc. of IEEE CPMT Symposium Japan 2018, 189-192, Kyoto, Nov. 2018.
Shuya Kikuchi, Hiroyuki YotsuyanagiandMasaki Hashizume : On Delay Measurement under Delay Variations in Boundary Scan Circuit with Embedded TDC, Proc. 2019 IEEE International Test Conference in Asia, 169-174, Tokyo, Sep. 2019.
Hanna Soneda, Masaki Hashizume, Hiroyuki YotsuyanagiandShyue-Kung Lu : Electrical Field Test Method of Resistive Open Defects between Dies by Quiescent Currents through Embedded Diodes, Proc. of The IEEE 2019 International 3D Systems Integration Conference, P4022-1-P4022-5, Sendai, Oct. 2019.
Kanda Michiya, Masaki Hashizume, Ali Ashikin Binti Fara, Hiroyuki YotsuyanagiandShyue-Kung Lu : Open Defect Detection Not Utilizing Boundary Scan Flip-Flops in Assembled Circuit Boards, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol.10, No.5, 895-907, 2020.
Sako Fumiya, yuki ikiri, Masaki Hashizume, Hiroyuki Yotsuyanagi, Yokoyama HiroshiandShyue-Kung Lu : Temperature Sensing with a Relaxation Oscillator in CMOS ICs, Proc. of The 35th International Technical Conference on Circuits/Systems, Computers and Communications, 141-144, (都市), July 2020.
Yuya Okumoto, Hiroyuki Yotsuyanagi, Masaki HashizumeandShyue-Kung Lu : Detectable Resistance Increase of Open Defects in Assembled PCBs by Quiescent Currents through Embedded Diodes, Proc. of 2021 International Conference on Electronics Packaging (ICEP), Tokyo, May 2021.
Masao Ohmatsu, Fumiya Sako, Ikiri Yuki, Hiroyuki Yotsuyanagi, Lu Shyue-KungandMasaki Hashizume : Detectability of Open Defects at Interconnects between Dies in 3D Stacked ICs with Relaxation Oscillators, Proc. of IEEE CPMT Symposium Japan 2022, 94-95, Kyoto, Nov. 2022.
Ohmatsu Masao, Yuto Ohtera, Yuki Ikiri, Hiroyuki Yotsuyanagi, Shyue-Kung LuandMasaki Hashizume : Enhanced Interconnect Test Method for Resistive Open Defects in Final Tests with Relaxation Oscillators, Proc.of IEEE 31st Asian Test Symposium, 49-53, (都市), Nov. 2022.
Miki Hayato, Eisuke Ohama, Hiroyuki YotsuyanagiandMasaki Hashizume : Evaluation of a PUF Embedded in the Delay Testable Boundary Scan Circuit, Proc. of 2023 International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC), 896-901, Cheju, June 2023.
Daichi Akamatsu, Hiroyuki YotsuyanagiandMasaki Hashizume : Design of an Efficient PRPG for Testing an Approximate Multiplier Using Truncation, Proc. of 2024 International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC), (頁), Okinawa, July 2024.
Yamahashi Yuya, Ohmatsu Masao, Hiroyuki Yotsuyanagi, Shyue-Kung LuandMasaki Hashizume : Dependence of Threshold Values for Interconnect Testing with Relaxation Oscillators on Unit-to-unit Variations of ICs, 2024 International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC), Okinawa, July 2024.
Daichi Akamatsu, Hiroyuki YotsuyanagiandMasaki Hashizume : Design of an Efficient PRPG for Testing an Approximate Multiplier Using Truncation, Proc. of 2024 International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC), (頁), Okinawa, July 2024.---(Modified by 四柳 浩之 at 2024年9月6日(金) 14:42:13)
Masaki Hashizume, Daisuke Yoneda, Hiroyuki Yotsuyanagi, Tetsuo Tada, Takeshi Koyama, Ikuro MoritaandTakeomi Tamesada : IDDQ Test Method Based on Wavelet Transformation for Noisy Current Measurement Environment, Proc. of Asian Test Symposium 2004, (巻), (号), 112-117, Kenting, Taiwan, Nov. 2004.
Masaki Hashizume, Akira Ono, Masahiro IchimiyaandHiroyuki Yotsuyanagi : Open Lead Detection of CMOS ICs by Low Pressure Probing, Proceedings og International Conference on Electronics Packaging 2007, (巻), (号), 359-364, Tokyo, April 2007.
Shiraishi Yudai, Masaki Hashizume, Hiroyuki Yotsuyanagi, Tada TetsuoandLu Shyue-Kung : Electrical Test Method of Open Defects at Data Buses in 3D SRAM IC, Proc. of International Conference on Electronics Packaging 2014, 235-238, (都市), April 2014.
Yudai Shiraishi, Masaki Hashizume, Hiroyuki Yotsuyanagi, Tetsuo TadaandShyue-Kung Lu : Electrical Test Method of Open Defects at Data Buses in 3D SRAM IC, Proceedings of International Conference on Electronics Packaging 2014, 235-238, Toyama, Japan, April 2014.
Shyue-Kung LuandMasaki Hashizume : Integration of Hard Repair Techniques with ECC for Enhancing Fabrication Yield Reliability of Embedded Memories, Proc. of the 24th IEEE Asian Test Symposium 2015, 49-54, Bombay, Nov. 2015.
Masaki Hashizume, Shoichi Umezu, Yuki Ikiri, Hiroyuki YotsuyanagiandShyue-Kung Lu : Test Circuit for Electrical Interconnect Tests of 3D ICs without Boundary Scan Flip Flops, Proc. of the 16th IEEE Workshop on RTL and High Level Testing, (巻), (号), S2-2-1-S2-2-4, Bombay, Nov. 2015.
Shyue-Kung Lu, Hao-Cheng Jheng, Hao-Wei LinandHiroyuki Yotsuyanagi : Address Remapping Techniques for Enhancing Fabrication Yield of Embedded Memories, Journal of Electronic Testing - Theory and Applications, Vol.34, No.4, 435-446, 2018.